Copper Foil Daim kab xev|Ib sab tooj liab|EMI Shielding & Grounding Adhesive Daim kab xev

Copper Foil Daim kab xev|Ib sab tooj liab|EMI Shielding & Grounding Adhesive Daim kab xev
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Muaj-qib ib zaug-sab conductive copper foil daim kab xev rau electronics EMI/RFI shielding. Ultra- qhov chaw qis qis (tsawg dua lossis sib npaug rau 0.05 Ω). Kev cai precision tuag- txiav muaj rau smartphones, transformers, thiab hluav taws xob sib dhos.
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product-800-800

Tib -Side Conductive Copper Foil Daim kab xev rau EMI/RFI Shielding - STK

 

STK's Single-Side Conductive Copper Foil Tape is a premium electronic-grade material designed to solve complex electromagnetic compatibility (EMC) and grounding challenges. It is engineered using a high-purity copper foil backing (>99.95%) coated nrog ib tug advanced, chemically cross-linked acrylic nplaum matrix uas muaj tusyees dispersed conductive micro- hais.

Tsis zoo li tus qauv zoo nkauj tooj liab foils, qhov kev lag luam no - qib daim kab xev muab tshwj xeeb ib leeg - sab conductivity. Qhov no txhais tau hais tias cov tooj liab thim rov qab yog qhov ua tau zoo raws nws qhov chaw (X thiab Y axes), thaum cov nplaum nplaum nplaum tseem muab cov kev coj ua zoo tshaj plaws (Z-axis txuas ntxiv). Thaum siv rau hauv hluav taws xob substrate, nws tsim kom muaj kev sib txuas ntawm hluav taws xob tam sim thiab txhim khu kev qha los ntawm cov kab ntawv cog lus, ua rau nws yog ib qho tseem ceeb rau EMI / RFI shielding daim ntaub ntawv hauv electronics.

 

Technical Specifications

 

Khoom npe

Conductive Copper Foil Daim kab xev

Conductive Copper Foil Daim kab xev

Conductive Copper Foil Daim kab xev

Conductive Copper Foil Daim kab xev

Conductive Copper Foil Daim kab xev

Conductive Copper Foil Daim kab xev

Tin-Plating tooj liab foil daim kab xev

 

Rov qab

Copper foil / Nano Carbon tooj liab ntawv ci

Copper foil / Nano Carbon tooj liab ntawv ci

Copper foil / Nano Carbon tooj liab ntawv ci

Copper foil / Nano Carbon tooj liab ntawv ci

Copper foil / Nano Carbon tooj liab ntawv ci

Copper foil / Nano Carbon tooj liab ntawv ci

tooj liab ntawv ci

 

TotalThickness
(mm)

0.02

0.03

0.05

0.06

0.07

0.09

0.12

 

Copper foil Thickness (hli)

0.009

0.009

0.018

0.025

0.035

0.05

0.045

 

Peel Adhesion

1.2

1.2

1.2

1.2

1.2

1.2

   

Surface Resistance (Ω)

Tsawg dua los yog sib npaug li 0.05

Tsawg dua los yog sib npaug li 0.05

Tsawg dua los yog sib npaug li 0.05

Tsawg dua los yog sib npaug li 0.05

Tsawg dua los yog sib npaug li 0.05

Tsawg dua los yog sib npaug li 0.05

Tsawg dua lossis sib npaug li 0.03

 

tuav hwj chim
1kg / 25mm / h

48

48

48

48

48

48

48

 

Short -lub sij hawm kub( degree)

120

120

120

120

120

120

250

 

Ntev -lub sij hawm kub( degree)

80

80

80

80

80

80

220

 

Lus ceeb toom

Ib sab conductive thiab ob sab conductive raws li kev xaiv

 

Advanced EMI/RFI Shielding & Grounding rau High -Density Electronics
 
 

Raws li cov khoom siv hluav taws xob sib txuas ua kom sib zog thiab siab - zaus, txo cov suab nrov sab hauv yuav yog thawj qhov kev txwv. STK's Conductive Copper Daim kab xev tsom rau cov qhov tsis zoo no:

 

Uncompromising EMI/RFI Shielding

The dense, high-purity copper backing acts as an excellent Faraday cage, reflecting and absorbing airborne electromagnetic waves (EMI) and radio frequency interference (RFI) across a frequency range of 30 MHz to 1 GHz.

 
 

Static Dissipation & Reliable Grounding

Tshem tawm cov nqi hluav taws xob zoo li qub sai sai thiab muab qhov qis - tsis kam mus rau hauv av rau cov ntawv luam tawm yooj yim (PCBs) thiab hloov pauv (FPCs).

 
 

Display Component Integration

Qhov zoo tshaj plaws rau hauv av thiab tiv thaiv cov khoom siv hluav taws xob sab hauv hauv PAD, PDP, LCD cov ntxaij vab tshaus, thiab cov khoos phis tawj, cais cov tsav tsheb tsis zoo los ntawm cov xov tooj cua ambient.

 
 

Zoo heev Conformability

Cov tuag- cov ntawv nyiaj mos tooj liab hloov tau yooj yim rau lub kaum ntse ntse, contours, thiab cov vaj tsev hlau nyuaj yam tsis tau tawg lossis tshem tawm ntawm cov npoo.
 

 
Alternatives / Sib piv
 

Brand Alternatives

Sib npaug rau: 3M 1181 Copper Foil Shielding Daim kab xev
Piv rau: tesa conductive tooj liab ntawv ci daim kab xev
Piv rau: Nitto EMI shielding tooj liab daim kab xev

Sib piv Logic

Tib copper foil backing nrog conductive nplaum system
Tsim los rau EMI shielding, grounding, thiab static discharge applications
Zoo li conductivity thiab tiv thaiv kev ua tau zoo

Tus nqi -Cov kev xaiv zoo

Factory direct copper foil tapes muab:
Kev txuag nyiaj kwv yees li 30% -60%
Custom widths, lengths, and die-txiav hom
Kev coj tus kheej thiab tsis yog - cov kev xaiv nplaum nplaum
OEM / private daim ntawv lo ntim

 

Khoom siv

 

 

product-410-257
product-410-257
product-410-257
product-411-257

 

Cim npe nrov: conductive tooj liab daim kab xev|ib sab tooj liab daim kab xev|emi shielding & grounding nplaum daim kab xev, Tuam Tshoj conductive tooj liab ntawv ci daim kab xev|ib sab tooj liab daim kab xev|emi shielding & grounding nplaum daim kab xev manufacturers, lwm tus neeg, Hoobkas

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