Pab pawg tshawb fawb tau coj los ntawm Prof.Huang XingyithiabDr. KunmingntawmShanghai Jiao Tong Universitytau tsim ibmultilayer thermally coj thiab hluav taws xob npias daim kab xev (mtceit)Cov. Qhov kev txhim kho no ua rau muaj CPU kub txo tau txog9 kev kawm, Muab cov tshuaj tshiab rau cov cua sov tsis haum hauv cov khoom siv hluav taws xob.
Mtceit qauv qhaub cijGraphene ntawv(siab thermal conductivity core) nruab nrab ntawmBnns -}}}}}}}}}}}}}} usexesive txheej, ua ke nrog aSilicone roj hmab (SR) sib xyawmuajhexagonal boron nitride (h - bn)Flakes. Ntawm qhov tuab ntawm kwv yees li300 μm, daim kab xev ua tiav ibHauv - dav hlau thermal conductivity ntawm 121.22 w / min k, a ntim resistivity ntawm 5.07 × 10¹¹ ω ω · cm, thiab aWeibull cov xeeb ceem tsis tau zoo li lub zog ntawm 36.9 kv / hli.
Nyob rau hauv tiag - thoob ntiaj teb kev xeem, mtceit txo tusCPU kub ntawm lub laptop nyias los ntawm 9 degreethiab ruaj khovDaim vis dis aus tus nqi hloov pauv tsis pub dhau tsawg dua lossis sib npaug rau 0.1 FPSNyob rau hauv Ultra - nyias smartphones tsis muaj cua txias.
Txoj kev tshawb no, hu"Graphene ntawv - bied multiLyer thermes nrog kev rwb thaiv hluav taws xob rau kev kub ntxhov rau kev kub ntxhov,"tau luam tawm nyob rau hauvCov ntaub ntawv ua haujlwm siab (AFM).
Daim duab 1. Tsim ntawm MTCIT.
(a) Schematic piv txwv ntawm cov cua sov dissipation system nyob rau hauv compact cov khoom siv hluav taws xob ua ke hauv MTCIT.
(b) Kev faib tawm saum npoo deg ntawm cov qauv sib txawv raws li cov qauv sib txawv hauv qab - lub xeev cov xwm txheej hauv cov xwm txheej finite.
(c-e) Qhov ntau tshaj plaws sib npaug kub ntawm cov txheej txheem cua sov (c) dav hlau (}) ultraigh -} κ // txheej raws li ntawm cov txheej txheej nplaum thiab txheej tom qab.
Daim duab 2. Cov qauv thiab cov kws kho mob ntawm MtCit.
(a) cov duab kho qhov muag ntawm mtceit thiab cov ntawv ua lag luam graphene.
(b) Hla - seem thiab (c) interlayer compact sem cov duab ntawm mtceit.
(d) EDS Spectrum thiab (E) XRD tus qauv ntawm Mtceit.
(f) Dabtsi Yog Khoov thiab (G) Duab Ntawm Mtceit.
(h) kev ntxhov siab tensile-strain nkhaus ntawm mtceit.
Daim duab 3. Thermal conductivity thiab rwb thaiv hluav taws xob ntawm mtosits.
Daim duab 4. Cua sov dissipation ntawm ib lub laptop nyias.
(a) cov duab kho qhov muag ntawm lub laptop mothopoard. Qhov loj ntawm mtceit yog 130 hli × 60 hli.
(b) Daim duab qhia schematic ntawm qhov yooj yim CPU cua sov dissipation system.
(c) infrared thermal duab ntawm lub laptop.
(d) kev sib txawv kub thiab (e) CPU kub ntawm 1200 s. Lub inset in (d) qhia cov duab kho qhov muag ntawm lub laptop kuaj.
Txhua qhov kev ntsuam xyuas tau ua raws li kev ua haujlwm ib txwm muaj. Qhov ntsuas kub tau ntsuas los ntawm lub tsim tsa los ntawm lub tsev ua kom tiav- hauv CPU sensor thiab saib xyuas siv AIDA64 huab software heev.
Daim duab 5. Cua sov dissipation ntawm ib ultra - nws lub xov tooj smartphone tsis muaj cua txias.
